Item
Description
Specification
1
Layer
count 2~18 Layer
2
Board thickness
0.4~3.2mm
3
Maximum Working panel
size 21¡¨x24¡¨
4
Cu foil thickness
(Both inner and outer layer)
1/3 ~3 oz
5
Minimum finished
hole(machenical)
0.2 mm
6
Minimum finished hole
(Laser Drill)
0.15mm
7
HDI Technology
BVH/ Build up/ 1+N+1
8
Minimum trace width/space
for inner layer
3/3 mil
9
Minimum trace width/space
for outer layer
3/3 mil
10
Maximum Aspect ratio
1:10
11
Impedance control
+/- 8%
12
Land Size
(Diameter over Drill)
12 mil
13
Layer to layer registration
+/- 3mil
14
Warpage
0.75%
15
Surface Finishes
HASL/ENIG/Immersion Tin/
Immersion Silver/Immersion Au/
Pb-Free HASL/Carbon Ink/
OSP/Selective ENIG
