技術能力

ITEMDESCRIPTIONSPECIFICATION
1 Layer Count 2~20 Layer
2 Board thickness 0.3~3.2mm
3 Maximum Working Panel size 22”x26”
4 Material CEM1/ CEM3/FR4 TG140/FR4 TG150/High TG/Halogen free/Aluminum/Rogers/NELCO/Low DK, DF......
5 Cu foil thickness (Both inner and outer layer) 1/3~6 oz
6 Minimum finished hole size 4 mil
7 Board thickness 0.4~3.2mm
8 Minimum width and space of inner layer trace 2.5 mil
9 Minimum width and space of outer layer trace 2.5 mil
10 Via Technology

Through hole/ BVH/HDI/

  Via in pad

11 Impedance control +/- 7%
12 Maximum aspect ratio 1:12
13 Layer to layer registration +/- 2 mil
14 Warpage 0.4%
15 Land size(Diameter over drill) 12 mil
16 Surface finishes OSP/ENIG/Im Ag/Im Tin/ HASL/ Pb-free HASL/ Selective Au/Peelable mask/Carbon Ink/

技術發展

技術研發 R&D

面對市場的激烈競爭,霖宏將持續改善現有的製程能力、技術、設備、引進新的技術提高品質、縮短交期、降低成本、開發高價值的產品。

ITEM2014201520162017
Min Line Width / Space(Mil) 4/4 3/3 2.8/2.8 2.5/2.5
Machanical Min Through Hole Size(Mil) 10 8 6 6
Impedance Tolerance +/-12% +/-10% +/- 8% +/- 7%
Max Layer Count 14 16 18 22
Via in Pad & Build-up Tech NO YES
Conventional Blind & Buried Via Hole NO YES
Aspect Ratio 8:1 10:1 10:1 12:1
Material FR4;Heavy
Copper
High Tg FR4
(Tg150, Tg170, Tg180)
Halogen Free; Rogers
Teflon
Anti-Caf;
Low DK Material
Finish Board Thickness(Mil) 18 14 12 10
Surface Treatment HASL/ENIG/Immersion Tin/Immersion Silver/Immersion Au/
Pb-Free HASL/Carbon Ink/OSP/Selective Gold