Item
2008
2009
2010
2011
Min Line Width /
Space(Mil)
4/4
3/3
3/3
2/2
Machanical Min
Through Hole Size(Mil)
10
8
8
6
Impedance Tolerance
+/-12%
+/-10%
+/-8%
+/-8%
Max Layer Count
10
16
20
24
Pad On Pad & Build-up Tech
NO
YES
Conventional Blind
& Buried Via Hole
NO
     YES
Aspect Ratio
8:1
10:1
10:1
12:1
Material
FR4;Heavy
Copper
High Tg FR4
(Tg150, Tg170, Tg180)
Halogen Free
Teflon/Rogers;
Anti-Caf;
Low DK Material
Finish Board
Thickness(Mil)
18
14
12
10
Surface Treatment
HASL/ENIG/Immersion Tin/Immersion Silver/Immersion Au/
Pb-Free HASL/Carbon Ink/OSP/Selective Gold
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