Technology
Tech Capability
| ITEM | DESCRIPTION | SPECIFICATION |
|---|---|---|
| 1 | Layer Count | 2~20 Layer |
| 2 | Board thickness | 0.3~3.2mm |
| 3 | Maximum Working Panel | size 22”x26” |
| 4 | Material | CEM1/ CEM3/FR4 TG140/FR4 TG150/High TG/Halogen free/Aluminum/Rogers/NELCO/Low DK, DF...... |
| 5 | Cu foil thickness (Both inner and outer layer) | 1/3~6 oz |
| 6 | Minimum finished hole size | 4 mil |
| 7 | Board thickness | 0.4~3.2mm |
| 8 | Minimum width and space of inner layer trace | 2.5 mil |
| 9 | Minimum width and space of outer layer trace | 2.5 mil |
| 10 | Via Technology |
Through hole/ BVH/HDI/ Via in pad |
| 11 | Impedance control | +/- 7% |
| 12 | Maximum aspect ratio | 1:12 |
| 13 | Layer to layer registration | +/- 2 mil |
| 14 | Warpage | 0.4% |
| 15 | Land size(Diameter over drill) | 12 mil |
| 16 | Surface finishes | OSP/ENIG/Im Ag/Im Tin/ HASL/ Pb-free HASL/ Selective Au/Peelable mask/Carbon Ink/ |
Tech Roadmap
Technology R&D
Facing the fierce competition from the market, Lin-Horn will keep on upgrading the produc-tion capability and equipment. We will develop new technology to enhance quality, shorten deliv-ery, reduce cost and exploit high value added products.
| ITEM | 2014 | 2015 | 2016 | 2017 |
|---|---|---|---|---|
| Min Line Width / Space(Mil) | 4/4 | 3/3 | 2.8/2.8 | 2.5/2.5 |
| Machanical Min Through Hole Size(Mil) | 10 | 8 | 6 | 6 |
| Impedance Tolerance | +/-12% | +/-10% | +/- 8% | +/- 7% |
| Max Layer Count | 14 | 16 | 18 | 22 |
| Via in Pad & Build-up Tech | NO | YES | ||
| Conventional Blind & Buried Via Hole | NO | YES | ||
| Aspect Ratio | 8:1 | 10:1 | 10:1 | 12:1 |
| Material | FR4;Heavy Copper |
High Tg FR4 (Tg150, Tg170, Tg180) Halogen Free; Rogers |
Teflon Anti-Caf; Low DK Material |
|
| Finish Board Thickness(Mil) | 18 | 14 | 12 | 10 |
| Surface Treatment | HASL/ENIG/Immersion Tin/Immersion Silver/Immersion Au/ Pb-Free HASL/Carbon Ink/OSP/Selective Gold |
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