技術研發
技術能力
| ITEM | DESCRIPTION | SPECIFICATION |
|---|---|---|
| 1 | Layer Count | 2~20 Layer |
| 2 | Board thickness | 0.3~3.2mm |
| 3 | Maximum Working Panel | size 22”x26” |
| 4 | Material | CEM1/ CEM3/FR4 TG140/FR4 TG150/High TG/Halogen free/Aluminum/Rogers/NELCO/Low DK, DF...... |
| 5 | Cu foil thickness (Both inner and outer layer) | 1/3~6 oz |
| 6 | Minimum finished hole size | 4 mil |
| 7 | Board thickness | 0.4~3.2mm |
| 8 | Minimum width and space of inner layer trace | 2.5 mil |
| 9 | Minimum width and space of outer layer trace | 2.5 mil |
| 10 | Via Technology |
Through hole/ BVH/HDI/ Via in pad |
| 11 | Impedance control | +/- 7% |
| 12 | Maximum aspect ratio | 1:12 |
| 13 | Layer to layer registration | +/- 2 mil |
| 14 | Warpage | 0.4% |
| 15 | Land size(Diameter over drill) | 12 mil |
| 16 | Surface finishes | OSP/ENIG/Im Ag/Im Tin/ HASL/ Pb-free HASL/ Selective Au/Peelable mask/Carbon Ink/ |
技術發展
技術研發 R&D
面對市場的激烈競爭，霖宏將持續改善現有的製程能力、技術、設備、引進新的技術提高品質、縮短交期、降低成本、開發高價值的產品。
| ITEM | 2020 | 2021 | 2022 |
|---|---|---|---|
| Min Line Width / Space(Mil) | 3/3 | 2/2 | 2/2 |
| Machanical Min Through Hole Size(Mil) | 8 | 6 | 6 |
| Impedance Tolerance | +/-10% | +/- 8% | +/- 7% |
| Max Layer Count | 18 | 20 | 22 |
| Via in Pad & Build-up Tech | YES | ||
| Conventional Blind & Buried Via Hole | YES | ||
| Aspect Ratio | 10:1 | 10:1 | 12:1 |
| Material | FR 4 Heavy copper (6 oz) | Low DK; Low Loss |
Low Dk; Super Low Loss |
| Back drill Capability | Depth :+/- 6 mil | Depth :+/- 4 mil | Depth :+/- 4 mil |